Electronic assemblies are the heart of all modern
electronics. They house the essential chip, generate
semiconductor input/output, and take care of the heat
generated by the process. The explosive growth of
communications and consumer electronics applications has
suddenly made a knowledge of the fabrication process a very
in-demand and lucrative skill.
Even beginners, with no advanced degrees or mathematical
backgrounds will be able to quickly and easily learn the
entire electronic assembly fabrication process wi th this
well-illustrated comprehensive tutorial.
Electronic assemblies are the heart of all modern
electronics. They house the essential chip, generate
semiconductor input/output, and take care of the heat
generated by the process. The explosive growth of
communications and consumer electronics applications has
suddenly made a knowledge of the fabrication process a very
in-demand and lucrative skill.
Even beginners, with no advanced degrees or mathematical
backgrounds will be able to quickly and easily learn the
entire electronic assembly fabrication process wi th this
well-illustrated comprehensive tutorial.
ELECTRONIC ASSEMBLY FABRICATION will prove invaluable to
nonspecialists and managers as well as engineers and
technicians working in the development, marketing, or
manufacture of electronic products, and anyone else who
wants to get familiar with and profit from one of the major
growth areas in the field of electronics.
Contents
- Preface
- Chapter 1: Printed Circuit History and Overview
- Chapter 2: Development and Fabrication of IC Chips
- Chapter 3: Packaging of IC Chips
- Chapter 4: Laminates and Prepregs as Circuit Board Base
Materials
- Chapter 5: Printed Circuit Board Fabrication
- Chapter 6: Package and Component Attachment and
Interconnection
- Chapter 7: Solder Materials and Processes for
Electronic Assembly Fabrication
- Chapter 8: Printed Wiring Board Cleaning
- Chapter 9: Board Coating Materials and Processes
- Chapter 10: Flexible and Rigid Flexible
Fabrication
- Chapter 11: Fabrication and Properties of Electronic
Ceramics and Composites
- Chapter 12: Hybrid Microelectronics and Multichip
Module Technologies
- Chapter 13: Environmental Considerations in Electronic
Assembly Fabrication