This comprehensive guide provides cutting edge
information on lead-free, halogen-free, and
conductive-adhesive technologies and their application to
low-cost, high-density, reliable, and green products.
Essential for electronics manufacturing and packaging
professionals who wish to master lead-free, halogen-free,
and conductive-adhesive problem solving methods, and those
demanding cost-effective designs and high-yield
environmental benign manufacturing processes, this valuable
reference covers all aspects of this fast-growing
field.
Written for design, materials, process, equipment,
manufacturing, reliability, component, packaging, and
system engineers, and technical and marketing managers in
electronics and photonics packaging and interconnection,
this book teaches a practical understanding of the cost,
design, materials, process, equipment, manufacturing, and
reliability issues of lead-free, halogen-free, and
conductive-adhesive technologies.
Contents
- Introduction to Environmentally Benign Electronics
Manufacturing
- Chip (Wafer) - Level Interconnects with Lead-Free
Solder Bumps
- WLCSP with Lead-Free Solder Bumps on PCB/Substrate
- Chip (Wafer) - Level Interconnects with Solderless
Bumps
- WLCSP with Solderless Bumps on PCB/Substrate
- Environmentally Benign Molding Compounds for IC
Packages
- Environmentally Benign Die Attach Films for IC
Packaging
- Environmental Issues for Conventional PCBs
- Halogenated and Halogen-Free Materials for Flame
Retardation
- Fabrication of Environmentally Friendly PCB
- Global Status of Lead-Free Soldering
- Development of Lead-Free Solder Alloys
- Prevailing Lead-Free Alloys
- Lead-Free Surface Finishes
- Implementation of Lead-Free Soldering
- Challenges for Lead-Free Soldering
- Introduction to Conductive Adhesives
- Conductivity Establishment of Conductive Adhesives
- Mechanisms Underlying the Unstable Contact Resistance
of ECAs
- Stabilization of Contact Resistance of Conductive
Adhesives