Electronics manufacturing - with lead-free, halogen-free & conductive-adhesive materials

This comprehensive guide provides cutting edge information on lead-free, halogen-free, and conductive-adhesive technologies and their application to low-cost, high-density, reliable, and green products. Essential for electronics manufacturing and packaging professionals who wish to master lead-free, halogen-free, and conductive-adhesive problem solving methods, and those demanding cost-effective designs and high-yield environmental benign manufacturing processes, this valuable reference covers all aspects of this fast-growing field.

Written for design, materials, process, equipment, manufacturing, reliability, component, packaging, and system engineers, and technical and marketing managers in electronics and photonics packaging and interconnection, this book teaches a practical understanding of the cost, design, materials, process, equipment, manufacturing, and reliability issues of lead-free, halogen-free, and conductive-adhesive technologies.

Contents

1. Introduction to Environmentally Benign Electronics Manufacturing
2. Chip (Wafer) - Level Interconnects with Lead-Free Solder Bumps
3. WLCSP with Lead-Free Solder Bumps on PCB/Substrate
4. Chip (Wafer) - Level Interconnects with Solderless Bumps
5. WLCSP with Solderless Bumps on PCB/Substrate
6. Environmentally Benign Molding Compounds for IC Packages
7. Environmentally Benign Die Attach Films for IC Packaging
8. Environmental Issues for Conventional PCBs
9. Halogenated and Halogen-Free Materials for Flame Retardation
10. Fabrication of Environmentally Friendly PCB
11. Global Status of Lead-Free Soldering
12. Development of Lead-Free Solder Alloys
13. Prevailing Lead-Free Alloys
14. Lead-Free Surface Finishes
15. Implementation of Lead-Free Soldering
16. Challenges for Lead-Free Soldering
17. Introduction to Conductive Adhesives
18. Conductivity Establishment of Conductive Adhesives
19. Mechanisms Underlying the Unstable Contact Resistance of ECAs
20. Stabilization of Contact Resistance of Conductive Adhesives